Stefan Mileschin

United Microelectronics Corporation, a leading global semiconductor foundry, today held a groundbreaking ceremony for its 300mm Fab 12A Phase 5 & 6 (P5 & P6) at its Tainan, Taiwan fab complex. The expansion begins UMC's new generation of 300mm manufacturing that will extend 28nm production and establish a solid foundation for 20nm and beyond to meet customers' high-end demand, thus ushering in the company's next era of growth.

Stan Hung, Chairman of UMC, said, "UMC remains optimistic about the long-term outlook of the semiconductor and foundry industries. However, with increasing industry volatility, a clearly defined business strategy is needed in order to take full advantage of upcoming market opportunities. We stay firm to our 'Customer-Driven Foundry Solutions' approach that is constituted on the classical foundry model and open ecosystem approach. This commitment enables true synergies between UMC, customers, and ecosystem partners. Based on this philosophy, we will continue to invest timely capex according to our key position in the supply chain so that customers, partners and UMC may prosper together. Cumulative capex for UMC's Fab 12A phases 1-4 is projected to reach US$ 8 billion, with P5 & P6 to add nearly US$ 8 billion more. There are further plans for P7 & P8. This balanced capacity expansion demonstrates UMC's determination to maintain self-sustainable growth."

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