 |  |  |  |  |
TSMC's 3D Stacked SoIC Packaging Making Quick Progress
| |||||||||
|
TSMC's 3D Stacked SoIC Packaging Making Quick Progress
| | |||||||
 |
 |
| | Thread Tools |
3rd June 2024, 06:22
| #1 |
| [M] Reviewer  Join Date: May 2010 Location: Romania
Posts: 152,436
 |  TSMC's 3D Stacked SoIC Packaging Making Quick Progress TSMC's 3D-stacked system-on-integrated chips (SoIC) advanced packaging technologies is set to evolve rapidly. In a presentation at the company's recent technology symposium, TSMC outlined a roadmap that will take the technology from a current bump pitch of 9μm all the way down to a 3μm pitch by 2027, stacking together combinations of A16 and N2 dies. https://www.anandtech.com/show/21414...-pitch-in-2027 |
|  |
|
Similar Threads | ||||
| Thread | Thread Starter | Forum | Replies | Last Post |
| TSMC packaging booked out | Stefan Mileschin | WebNews | 0 | 8th May 2024 04:07 |
| SK hynix Collaborates with TSMC on HBM4 Chip Packaging | Stefan Mileschin | WebNews | 0 | 19th April 2024 12:50 |
| TSMC to Build $2.87 Billion Facility For Advanced Chip Packaging | Stefan Mileschin | WebNews | 0 | 26th July 2023 06:15 |
| TSMC invests $2.87 billion in chip packaging plant | Stefan Mileschin | WebNews | 0 | 26th July 2023 06:14 |
| Microsoft says it is making progress on DNA storage | Stefan Mileschin | WebNews | 0 | 6th December 2021 07:19 |
| TSMC start making Intel’s Core i3 | Stefan Mileschin | WebNews | 0 | 22nd January 2021 07:58 |
| TSMC Teases 12-High 3D Stacked Silicon: SoIC Goes Extreme | Stefan Mileschin | WebNews | 0 | 26th August 2020 07:16 |
| Microsoft workers say it's making progress on diversity | Stefan Mileschin | WebNews | 0 | 13th November 2019 09:10 |
| TSMC’s 20nm follies could be making a market for Intel | Stefan Mileschin | WebNews | 0 | 23rd April 2014 07:13 |
| TSMC Plans to Start Making Chips Using 22nm Process Technology in 2011 | jmke | WebNews | 0 | 7th November 2008 19:04 |
| Thread Tools | |
| |
