TSMC has commenced mass-production of chips for Intel on its 3 nm EUV FinFET foundry node, according to a report by Taiwan industry observer DigiTimes. Intel is using the TSMC 3 nm node for the compute tile of its upcoming Core Ultra 300 "Lunar Lake" processor. The company went into depth about "Lunar Lake" in its Computex 2024 presentation. While a disaggregated chiplet-based processor like "Meteor Lake," the new "Lunar Lake" chip sees the CPU cores, iGPU, NPU, and memory controllers sit on a single chiplet called the compute tile, built on the 3 nm node; while the SoC and I/O components are disaggregated the chip's only other chiplet, the SoC tile, which is built on the TSMC 6 nm node.
https://www.techpowerup.com/323700/t...row-lake-tiles
TSMC Begins 3 nm Production for Intel's "Lunar Lake" and "Arrow Lake" Tiles
19th June 2024, 13:15
TSMC Begins 3 nm Production for Intel's "Lunar Lake" and "Arrow Lake" Tiles 
