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Toshiba Weds 3D NAND and TSV
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Toshiba Weds 3D NAND and TSV
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17th July 2017, 07:09
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| [M] Reviewer  Join Date: May 2010 Location: Romania
Posts: 153,575
 |  Toshiba Weds 3D NAND and TSV Toshiba on Wednesday introduced its first BiCS 3D TLC NAND flash chips with 512 GB and 1 TB capacities. . The new ICs stack 8 or 16 3D NAND devices using through silicon vias (TSVs) and are currently among the highest capacity non-volatile memory stacks available in the industry. Commercial products powered by the 512 GB and 1 TB packages are expected to hit the market in 2018, with an initial market focus on high-end enterprise SSDs http://www.anandtech.com/show/11627/...-tsvs-1tb-dies |
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