Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design

Stefan Mileschin · 27th September 2024, 10:39

Synopsys, Inc. today announced its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC's most advanced process and 3DFabric technologies to accelerate innovation for AI and multi-die designs. The relentless computational demands in AI applications require semiconductor technologies to keep pace. From an industry leading AI-driven EDA suite, powered by Synopsys.ai for enhanced productivity and silicon results to complete solutions that facilitate the migration to 2.5/3D multi-die architectures, Synopsys and TSMC have worked closely for decades to pave the path for the future of billion to trillion-transistor AI chip designs.

https://www.techpowerup.com/327011/s...ie-chip-design

27th September 2024, 10:39	#1
Stefan Mileschin [M] Reviewer Join Date: May 2010 Location: Romania Posts: 152,673	Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design Synopsys, Inc. today announced its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC's most advanced process and 3DFabric technologies to accelerate innovation for AI and multi-die designs. The relentless computational demands in AI applications require semiconductor technologies to keep pace. From an industry leading AI-driven EDA suite, powered by Synopsys.ai for enhanced productivity and silicon results to complete solutions that facilitate the migration to 2.5/3D multi-die architectures, Synopsys and TSMC have worked closely for decades to pave the path for the future of billion to trillion-transistor AI chip designs. https://www.techpowerup.com/327011/s...ie-chip-design

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