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SK hynix starts mass production of 12-layer HBM3E
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SK hynix starts mass production of 12-layer HBM3E
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27th September 2024, 08:14
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| [M] Reviewer  Join Date: May 2010 Location: Romania
Posts: 152,716
 |  SK hynix starts mass production of 12-layer HBM3E The new 12-layer HBM3E, according to SK hynix, will meet the world's highest standards in areas, including speed, capacity, and stability. Reaching speeds of up to 9.6Gbps, the new chips have a 50 percent increased capacity by stacking 12-layers of 3GB DRAM chips at the same thickness as the previous 8-layer HBM3E. According to SK hynix, each DRAM chip has been made 40 percent thinner and stacked vertically using TSV technology. https://fudzilla.com/news/59769-sk-h...12-layer-hbm3e |
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