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15th March 2024, 08:48 | #1 |
[M] Reviewer Join Date: May 2010 Location: Romania
Posts: 153,010
| Samsung Reportedly Acquiring New Equipment Due to Disappointing HBM Yields Industry insiders reckon that Samsung Electronics is transitioning to molded underfill (MR-MUF) production techniques—rival memory manufacturer, SK Hynix, champions this chip making technology. A Reuters exclusive has cited claims made by five industry moles—they believe that Samsung is reacting to underwhelming HBM production yields. The publication proposes that: "one of the reasons Samsung has fallen behind (competing producers) is its decision to stick with chip making technology called non-conductive film (NCF) that causes some production issues, while Hynix switched to the mass reflow molded underfill (MR-MUF) method to address NCF's weakness." The report suggests that Samsung is in the process of ordering new MUF-related equipment. https://www.techpowerup.com/320380/s...ing-hbm-yields |
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