Samsung Launches Single-Chip uMCP Packages with LPDDR4X DRAM & UFS 3.0 Storage

Stefan Mileschin · 25th October 2019, 09:50

Samsung has introduced a new lineup of all-in-one memory packages for smartphones that integrate both DRAM and storage. The latest generation of uMCP devices now feature up to 12 GB of LPDDR4X DRAM as well as NAND flash storage with a UFS 3.0 interface, thus providing high performance memory for mainstream handsets in a cost-effective form-factor.

Samsung’s UFS-based multichip packages (uMCPs) integrate 10 GB or 12 GB of LPDDR4X-4266 memory (made using the company’s 2nd Generation 10nm-class process technology) as well as NAND flash storage featuring a UFS 3.0 interface. Since both new uMCP modules incorporate four DRAM devices, they will allow the latest SoCs with quad-channel LPDDR4X memory controllers to reach up to 34.1 GB/s memory bandwidth. Meanwhile on the NAND side of matters, Samsung's official announcement doesn't list what storage capacities will be available there, but the company has commented that they can provide the uMCPs in a variety of capacities.

Meanwhile, the new uMCP devices are also mechanically compatible with Samsung's previous-generation 8GB uMCPs, utilizing the same 254FBGA package.

https://www.anandtech.com/show/15022...ufs-30-storage

25th October 2019, 09:50	#1
Stefan Mileschin [M] Reviewer Join Date: May 2010 Location: Romania Posts: 153,514	Samsung Launches Single-Chip uMCP Packages with LPDDR4X DRAM & UFS 3.0 Storage Samsung has introduced a new lineup of all-in-one memory packages for smartphones that integrate both DRAM and storage. The latest generation of uMCP devices now feature up to 12 GB of LPDDR4X DRAM as well as NAND flash storage with a UFS 3.0 interface, thus providing high performance memory for mainstream handsets in a cost-effective form-factor. Samsung’s UFS-based multichip packages (uMCPs) integrate 10 GB or 12 GB of LPDDR4X-4266 memory (made using the company’s 2nd Generation 10nm-class process technology) as well as NAND flash storage featuring a UFS 3.0 interface. Since both new uMCP modules incorporate four DRAM devices, they will allow the latest SoCs with quad-channel LPDDR4X memory controllers to reach up to 34.1 GB/s memory bandwidth. Meanwhile on the NAND side of matters, Samsung's official announcement doesn't list what storage capacities will be available there, but the company has commented that they can provide the uMCPs in a variety of capacities. Meanwhile, the new uMCP devices are also mechanically compatible with Samsung's previous-generation 8GB uMCPs, utilizing the same 254FBGA package. https://www.anandtech.com/show/15022...ufs-30-storage

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