Yesterday, Samsung Electronics had announced a new 3D IC packaging technology called eXtended-Cube, or “X-Cube”, allowing chip-stacking of SRAM dies on top of a base logic die through TSVs.
Current TSV deployments in the industry mostly come in the form of stacking memory dies on top of a memory controller die in high-bandwidth-memory (HBM) modules that are then integrated with more complex packaging technologies, such as silicon interposers, which we see in today’s high-end GPUs and FPGAs, or through other complex packaging such as Intel’s EMIB.
Samsung’s X-Cube is quite different to these existing technologies in that it does away with intermediary interposers or silicon bridges, and directly connects a stacked chip on top of the primary logic die of a design.
https://www.anandtech.com/show/15976...ing-technology
Samsung Announces "X-Cube" 3D TSV SRAM-Logic Die Stacking Technology
15th August 2020, 06:05
Samsung Announces "X-Cube" 3D TSV SRAM-Logic Die Stacking Technology 
