Stefan Mileschin

Chipzilla shares its roadmap

As Intel launches its new foundry business, its first customers include Qualcomm and Amazon Web Services, the chipmaker said.

Intel also shared the process and packaging technology roadmap that will take its product development through 2025, detailing new innovations and a new naming structure for its process nodes.

Intel CEO Kicking Pat Gelsinger said that building on Intel's leadership in advanced packaging, it was accelerating its roadmap to ensure Chipzilla was on a clear path to process performance leadership by 2025.

"The innovations unveiled today will not only enable Intel's product roadmap; they will also be critical for our foundry customers."

Qualcomm will use Intel's upcoming 20A process technology, which is expected to ramp up in 2024. Intel 20A will rely on two new technologies, RibbonFET and PowerVia.

For those who came in late, RibbonFET is Intel's new transistor architecture. It delivers faster transistor switching speeds while achieving the same drive current as multiple fins in a smaller footprint. PowerVia is Intel's industry-first implementation of backside power delivery, which is vital for those who need powerful backsides because it optimises signal transmission by eliminating the need for power routing on the front side of the wafer.

https://fudzilla.com/news/pc-hardwar...-intel-foundry