Stefan Mileschin

We've had the ability to stack chips and create multi-die packages for a while. Cooling powerful chips is a hard task, however, and so far multi-layer designs have primarily been used for low-power products like NAND flash chips. That might change in the near future. Researchers at Purdue University, working under a grant from DARPA, have developed a new way of cooling microprocessors using boiling dielectric fluid passing through micro-channels in the chips themselves.

http://techreport.com/news/32767/pur...-stacked-chips