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Micron announces smallest UFS 4.0 package at MWC 2024
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Micron announces smallest UFS 4.0 package at MWC 2024
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28th February 2024, 08:49
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| [M] Reviewer  Join Date: May 2010 Location: Romania
Posts: 153,575
 |  Micron announces smallest UFS 4.0 package at MWC 2024 At the Mobile World Congress 2024 in Barcelona, Micron has announced its latest UFS 4.0 package aimed at enabling next-generation of phone designs. Coming in up to 1TB of capacity and providing exceptional performance and power efficiency, the new UFS 4.0 package will not only allow smartphone makers to have more space due to the smaller package but also come up with faster and more responsive devices. https://fudzilla.com/news/mobile/585...ge-at-mwc-2024 |
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