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14th December 2021, 08:48 | #1 |
[M] Reviewer Join Date: May 2010 Location: Romania
Posts: 153,575
| Intel shows off plans to speed up and shrink chips Will gain market lead lost to TSMC Research teams at Intel unveiled work that the company believes will help it keep speeding up and shrinking computing chips over the next ten years, with several technologies aimed at stacking parts of chips on top of each other. Intel's Research Components Group introduced the work in papers at an international conference being held in San Francisco. The Silicon Valley company is working to regain a lead in making the smallest, fastest chips that it has lost in recent years to rivals like TSMC and Samsung. Intel CEO Pat Gelsinger laid out commercial plans aimed at regaining that lead by 2025, but this shows how Intel will compete beyond 2025. One of the ways Intel is packing more computing power into chips by stacking up "tiles" or "chiplets" in three dimensions rather than making chips all as one two-dimension piece. https://fudzilla.com/news/54035-inte...d-shrink-chips |
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