Intel’s EMIB Now Between Two High TDP Die: The New Stratix 10 GX 10M FPGA

Stefan Mileschin · 6th November 2019, 13:21

The best thing about manufacturing Field Programmable Gate Arrays (FPGAs) is that you can make the silicon very big. The nature of the repeatable unit design can absorb issues with a process technology, and as a result we often see FPGAs be the largest silicon dies that enter the market for a given manufacturing process. When you get to the limit of how big you can make a piece of silicon (known as the reticle limit), the only way to get bigger is to connect that silicon together. Today Intel is announcing its latest ‘large’ FPGA, and it comes with a pretty big milestone with its connectivity technology.

https://www.anandtech.com/show/15060...10-gx-10m-fpga

6th November 2019, 13:21	#1
Stefan Mileschin [M] Reviewer Join Date: May 2010 Location: Romania Posts: 153,575	Intel’s EMIB Now Between Two High TDP Die: The New Stratix 10 GX 10M FPGA The best thing about manufacturing Field Programmable Gate Arrays (FPGAs) is that you can make the silicon very big. The nature of the repeatable unit design can absorb issues with a process technology, and as a result we often see FPGAs be the largest silicon dies that enter the market for a given manufacturing process. When you get to the limit of how big you can make a piece of silicon (known as the reticle limit), the only way to get bigger is to connect that silicon together. Today Intel is announcing its latest ‘large’ FPGA, and it comes with a pretty big milestone with its connectivity technology. https://www.anandtech.com/show/15060...10-gx-10m-fpga

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