| Thread Tools |
9th September 2024, 07:25 | #1 |
[M] Reviewer Join Date: May 2010 Location: Romania
Posts: 152,472
| Coalition Formed to Accelerate the Use of Glass Substrates for Advanced Chips E&R Engineering Corp. hosted an event on August 28, 2024, in Taipei, Taiwan, where they launched the "E-Core System." This initiative, a combination of "E&R" and "Glass Core" inspired by the sound of "Ecosystem," led to the establishment of the "Glass Substrate Supplier E-Core System Alliance." The alliance aims to combine expertise to promote comprehensive solutions, providing equipment and materials for next-generation advanced packaging with glass substrates to both domestic and international customers. https://www.techpowerup.com/326369/c...s-and-chiplets |
Thread Tools | |
| |