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Bump Pitch Transformers Will Revolutionize Advanced 2.5D IC Packaging
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Bump Pitch Transformers Will Revolutionize Advanced 2.5D IC Packaging
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27th June 2024, 12:39
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| [M] Reviewer  Join Date: May 2010 Location: Romania
Posts: 150,416
 |  Bump Pitch Transformers Will Revolutionize Advanced 2.5D IC Packaging Dr. Larry Zu, Founder and CEO of Sarcina Technology, the Application Specific Advanced Packaging (ASAP) Design Service and Production leader, predicted that recent Bump Pitch Transformer (BPT) designs will speed 2.5D IC advanced packaging adoption to meet the red-hot demand for AI innovation. In remarks made in the Keysight Theater at the 61st Design Automation Conference, he envisioned new BPT technology paving the way for new artificial intelligence computing opportunities. https://www.techpowerup.com/323939/b...d-ic-packaging |
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