Breakable computers could be the next big thing

Stefan Mileschin · 10th February 2014, 08:20

Small Blue and its chums at PARC are working on computers which can self-destruct.

The big idea is that it would be handy for sensitive electronic components to able to self-destruct on command to keep them out of the hands of potential adversaries.

PARC and IBM are joining the Vanishing Programmable Resources (VAPR) programme of the US Defence Advanced Research Projects Agency (DARPA).

DARPA awarded a $2.1 million contract to PARC, and a $3.5 million contract to IBM for the VAPR program, which seeks to develop transient electronics that can physically disappear in a controlled way.

PARC and IBM, experts in microelectronics technologies, will develop electronic component materials that shatter into a million pieces when triggered. Another outfit, SRI International, meanwhile, is working on a disappearing silicon/air battery.

The method will use stress-engineered materials, silicon processing, and microchip handling and deposition to create a transience technology. This is called Disintegration Upon Stress-release Trigger, or DUST which is oddly how Techeye operates on a Monday morning.

http://news.techeye.net/science/brea...next-big-thing

10th February 2014, 08:20	#1
Stefan Mileschin [M] Reviewer Join Date: May 2010 Location: Romania Posts: 153,514	Breakable computers could be the next big thing Small Blue and its chums at PARC are working on computers which can self-destruct. The big idea is that it would be handy for sensitive electronic components to able to self-destruct on command to keep them out of the hands of potential adversaries. PARC and IBM are joining the Vanishing Programmable Resources (VAPR) programme of the US Defence Advanced Research Projects Agency (DARPA). DARPA awarded a $2.1 million contract to PARC, and a $3.5 million contract to IBM for the VAPR program, which seeks to develop transient electronics that can physically disappear in a controlled way. PARC and IBM, experts in microelectronics technologies, will develop electronic component materials that shatter into a million pieces when triggered. Another outfit, SRI International, meanwhile, is working on a disappearing silicon/air battery. The method will use stress-engineered materials, silicon processing, and microchip handling and deposition to create a transience technology. This is called Disintegration Upon Stress-release Trigger, or DUST which is oddly how Techeye operates on a Monday morning. http://news.techeye.net/science/brea...next-big-thing

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