Autopsy of an Intel CPU

jmke · 20th November 2010, 13:36

The first challenge is to get the actual silicon processor chip off of the plastic bonding board. When the processor is finished, it is turned upside down and bonded to the green circuit board. This allows the metal pads on the silicon chip and the pads on the circuit board to join, creating a connection. I believe that the CPU at that stage is heated up in order to melt the joints and thereby solder them together.

This is a piece of the processor. The side you're seeing was once facing towards the plastic circuit board. Each little hole is a metal pad connecting the interior of the chip to a macroscopic lead on the circuit board.

A processor contains many layers of metal leads in order to connect the transistors at the surface of the silicon chip into useful units. The metal layers are clearly visible through the small holes in the chip.

Focus is on middle layer.

In a CPU there are multiple layers of sandwiched metal leads going down to the transistors at the bottom (at the surface of the silicon wafer). I believe what we're seeing is simply those different layers.

http://www.sciencystuff.com/?p=24

20th November 2010, 13:36	#1
jmke Madshrimp Join Date: May 2002 Location: 7090/Belgium Posts: 79,022	Autopsy of an Intel CPU The first challenge is to get the actual silicon processor chip off of the plastic bonding board. When the processor is finished, it is turned upside down and bonded to the green circuit board. This allows the metal pads on the silicon chip and the pads on the circuit board to join, creating a connection. I believe that the CPU at that stage is heated up in order to melt the joints and thereby solder them together. This is a piece of the processor. The side you're seeing was once facing towards the plastic circuit board. Each little hole is a metal pad connecting the interior of the chip to a macroscopic lead on the circuit board. A processor contains many layers of metal leads in order to connect the transistors at the surface of the silicon chip into useful units. The metal layers are clearly visible through the small holes in the chip. Focus is on middle layer. In a CPU there are multiple layers of sandwiched metal leads going down to the transistors at the bottom (at the surface of the silicon wafer). I believe what we're seeing is simply those different layers. http://www.sciencystuff.com/?p=24 __________________

Similar Threads
Thread	Thread Starter	Forum	Replies	Last Post
Intel Core i5-760, Parity Quad Core CPU Performance and OC Guide	windwithme	Hardware Overclocking and Case Modding	3	21st October 2010 17:37
Intel K series relieve CPU multiplier limitation-Core i7-875K OC performance Review	windwithme	Hardware Overclocking and Case Modding	5	12th August 2010 20:18
The FTC Sues Intel Over CPU & GPU Competition	jmke	WebNews	0	17th December 2009 13:24
Intel i7 870 & i5 750 CPU Reviews Roundup Part 2	jmke	WebNews	2	10th September 2009 10:03
Big step to the future, GIGABYTE EX58 EXTREME with Intel I7 EXTREME 965 CPU	windwithme	General Madness - System Building Advice	11	14th November 2008 06:30
NVIDIA Brings SLI Technology to Intel Bloomfield CPU Platforms	jmke	WebNews	1	14th July 2008 23:13
Intel E8500 Core2 Duo CPU Review	jmke	WebNews	0	25th March 2008 11:26
ECS PF23 delivers benefits of Intel platform Mobile CPU technology to the Desktop	jmke	WebNews	0	14th March 2006 10:36
Intel to move to common CPU architecture	Sidney	WebNews	5	23rd August 2005 21:27
Half-Life 2 CPU Shootout: AMD versus Intel	jmke	WebNews	0	22nd November 2004 09:05