Applied Materials' New Deposition Tool Enables Copper Wires to Be Used for 2nm

Stefan Mileschin · 15th July 2024, 08:07

Although the pace of Moore's Law has undeniably slackened in the last decade, transistor density is still increasing with every new process technology. But there is a challenge with feeding power to smaller transistors, as with the smaller transistors comes thinner power wires within the chip, which increases their resistance and may cause yield loss. Looking to combat that effect, this week Applied Materials introduced its new Applied Endura Copper Barrier Seed IMS with Volta Ruthenium Copper Vapor Deposition (CVD) tool, which enables chipmakers to keep using copper for wiring with 2 nm-class and more advanced process technologies.

https://www.anandtech.com/show/21467...2nm-and-beyond

15th July 2024, 08:07	#1
Stefan Mileschin [M] Reviewer Join Date: May 2010 Location: Romania Posts: 152,472	Applied Materials' New Deposition Tool Enables Copper Wires to Be Used for 2nm Although the pace of Moore's Law has undeniably slackened in the last decade, transistor density is still increasing with every new process technology. But there is a challenge with feeding power to smaller transistors, as with the smaller transistors comes thinner power wires within the chip, which increases their resistance and may cause yield loss. Looking to combat that effect, this week Applied Materials introduced its new Applied Endura Copper Barrier Seed IMS with Volta Ruthenium Copper Vapor Deposition (CVD) tool, which enables chipmakers to keep using copper for wiring with 2 nm-class and more advanced process technologies. https://www.anandtech.com/show/21467...2nm-and-beyond

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