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Alphawave Semi Launches Industry's First 3nm UCIe IP with TSMC CoWoS Packaging
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Alphawave Semi Launches Industry's First 3nm UCIe IP with TSMC CoWoS Packaging
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31st July 2024, 07:32
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| [M] Reviewer  Join Date: May 2010 Location: Romania
Posts: 152,436
 |  Alphawave Semi Launches Industry's First 3nm UCIe IP with TSMC CoWoS Packaging Alphawave Semi, a global leader in high-speed connectivity and compute silicon for the world's technology infrastructure, has launched the industry's first 3 nm successful silicon bring-up of Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP with TSMC's Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology. https://www.techpowerup.com/325043/a...owos-packaging |
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