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2023 Interposers: TSMC Hints at 3400mm2 + 12x HBM in one Package
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2023 Interposers: TSMC Hints at 3400mm2 + 12x HBM in one Package
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26th August 2020, 08:24
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| [M] Reviewer  Join Date: May 2010 Location: Romania
Posts: 153,514
 |  2023 Interposers: TSMC Hints at 3400mm2 + 12x HBM in one Package High-performance computing chip designs have been pushing the ultra-high-end packaging technologies to their limits in the recent years. A solution to the need for extreme bandwidth requirements in the industry has been the shifts towards large designs integrated into silicon interposers, directly connected to high-bandwidth-memory (HBM) stacks. https://www.anandtech.com/show/16036...in-one-package |
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