Stefan Mileschin

What if you could take the benefits of solid-state speaker drivers — specifically, their extreme thinness and lack of moving parts — and bring them to cooling fans? That's what xMEMS aims to do with its new XMC-2400 µCooling (microcooling) chip. It's a 1mm-tall solid-state fan on a chip that can actively cool extremely thin devices like smartphones and tablets. Based on the same MEMS (Micro-electromechanical systems) technology as the company's upcoming ultrasonic driver inside headphones, the micro-cooling chip could lead to slim devices that are less prone to overheating and capable of better sustained performance.

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