Intel poaching TSMC senior engineers
@ 2024/07/31Adding to the intrigue, Intel has outsourced the production of its next-gen Core Ultra 200V "Lunar Lake" CPUs to TSMC. These chips, featuring CPU, GPU, NPU, and on-package memory on a single chiplet, will be crafted using TSMC's 3nm process nodes. The SoC and I/O dies, however, will be made on TSMC's 6nm process node.