Samsung announces Exynos W1000 chipset

The new Samsung Exynos W1000 SoC should be a significant improvement over the dual-core 5nm W930, and, as detailed by Samsung, uses company's own 3nm GAA process with fan-out panel-level packaging (FOPLP), promising small form factor and better heat dissipation, as well as system in a package (SiP), which integrates the power management circuit and embedded package on package (ePoP), which mounts DRAM and NAND flash memory directly on the SoC.