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@ 2024/01/18New chip packaging and testing business
Foxconn is teaming up with Indian software and engineering firm HCL Group to set up a chip packaging and testing business in India in a deal worth $37.2 million.
The move, revealed in a legal document with Taiwan's stock market, comes six months after Foxconn — also known as Hon Hai Precision — ditched a planned chip making joint venture with Indian firm Vedanta Group.
Under the terms of the deal, Foxconn’s Hon Hai Technology India Mega Development unit will get a 40 per cent share in a joint chip packaging and testing business — known as OSAT — with HCL Group.
Foxconn is teaming up with Indian software and engineering firm HCL Group to set up a chip packaging and testing business in India in a deal worth $37.2 million.
The move, revealed in a legal document with Taiwan's stock market, comes six months after Foxconn — also known as Hon Hai Precision — ditched a planned chip making joint venture with Indian firm Vedanta Group.
Under the terms of the deal, Foxconn’s Hon Hai Technology India Mega Development unit will get a 40 per cent share in a joint chip packaging and testing business — known as OSAT — with HCL Group.
