TSMC: 3nm Chips for Smartphones and HPCs Coming This Year

While TSMC formally started mass production of chips on its N3 (3nm-class) process technology late last year, the company is set to finally ship the first revenue wafers in the current quarter. During the most recent earnings call with analysts and investors, the company said that demand for 3 nm products was steady, and that numerous designs for smartphones and high-performance applications are incoming later this year. Furthermore, N3E manufacturing node is on track for high-volume manufacturing later this year.