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Follow us on TwitterMediaTek officially unveils the 4nm Dimensity 9200 SoC
@ 2022/11/09ARM Cortex-X3 prime core and Immortalis G715 GPU with hardware ray tracing
MediaTek has unveiled its latest flagship smartphone SoC, the Dimensity 9200. Built on TSMC 4nm (N4P) manufacturing process, this is also the first SoC to feature the ARM Cortex-X3 core based on ARMv9 architecture, as well as the new Immortalis-G715 GPU with hardware-based ray tracing.
“MediaTek’s Dimensity 9200 combines ultimate performance with significant power savings, extending battery life and keeping smartphones cool,” said JC Hsu, Corporate Vice President and General Manager of MediaTek’s wireless communications business unit at MediaTek. “With notably brighter image capturing and improved gaming speeds, along with the latest display enhancements, the Dimensity 9200 will bring new possibilities for next-gen smartphones that come in a variety of stylish and foldable form factors.”
MediaTek has unveiled its latest flagship smartphone SoC, the Dimensity 9200. Built on TSMC 4nm (N4P) manufacturing process, this is also the first SoC to feature the ARM Cortex-X3 core based on ARMv9 architecture, as well as the new Immortalis-G715 GPU with hardware-based ray tracing.
“MediaTek’s Dimensity 9200 combines ultimate performance with significant power savings, extending battery life and keeping smartphones cool,” said JC Hsu, Corporate Vice President and General Manager of MediaTek’s wireless communications business unit at MediaTek. “With notably brighter image capturing and improved gaming speeds, along with the latest display enhancements, the Dimensity 9200 will bring new possibilities for next-gen smartphones that come in a variety of stylish and foldable form factors.”
