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Team Group Memory Roundup: Great Expectations

Memory by JNav89GTBerry @ 2006-01-29

Team Group has recently begun an added push into the high performance PC sector and the overclocking community. Remember last fall when we first reviewed G.Skill memory when that company was a relative unknown, and we?re getting similar good feelings from this company; that they are continuing a trend of Taiwanese manufacturers to bring forth excellent products at excellent prices.

The Modules

The Modules

The modules tested today:

PC3200 TXDR2048M400HC2DC 2-3-3-5 Infineon BE5

PC3200 TXDR2048M400HC25DC 2,5-4-4-8 Team labeled

PC4000 TXDR2048M500HC25DC 2.5-3-3-6 Infineon CE6

PC4000 TXDR2048M500HC3DC 3-3-3-8 Micron based

PC4000 TXDR2048M500HC3DC 3-4-4-8 Samsung UCCC

Each kit was well packed in a plastic dual channel container. While nothing earth shattering in appearance, the protection afforded by the packaging is all that matters and in this, it succeeds. The modules themselves are nice looking. Gold colored heat spreaders are applied to each side of their respective DIMMs. No clip holds them on, so logic would hold that thermal adhesive allows them to stick.

Madshrimps (c)

One area of slight concern is seen in the picture above. The bios prom is raised higher than other IC or PCB components on the modules, and prevents one side of the spreader for fully contacting two of the IC’s/ram chips. While this really may not effect performance of the DIMM overall, it is nevertheless something of an oversight on the part of the manufacturer. Other than that, no other concerns were raised in inspection of the modules that gave me concern.

All modules use the popular Brain Power P808 PCB:

Madshrimps (c)

Except the Infineon CE6, it uses the P815 PCB:

Madshrimps (c)

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