LSCool LSHS-X500 CPU Cooler for P4 S478 and AMD A64 Review

Cooling/CPU Cooling by SidneyWong @ 2005-07-26

Here is a new Company into CPU cooling promising a low profile application using copper/heatpipe technology plus light weight in a traditional way. The design utilizes three heat pipes and copper fins. Let?s find out how it performs.

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Closer Look

Closer look:

The LSHS-X500 employs a low profile design unlike other heatsink introduced in recent months, which has the good and bad. The extra height will allow clearance of any surrounding surface mounted components inclusive of memory modules, PWM heat sinks or expansion cards. Whereas a low profile design will fit into tight spot such as some SFF cases.

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Side view of the heatsink without fan mounted.


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TIM is pre-screened on at the factory. For my test in different setups and comparison purpose the pre-applied TIM is removed and Artic Silver Ceramique is used.


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The aluminum base finished is excellent; my finger tells me it is almost identical to Thermalright XP-90 which will be used for comparison. A few very minor nicks can be seen, I'd suspect they come from handling in the factory prior to TIM application.


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The 92mm fan is snapped onto a bracket which is secured onto both sides of the heatsink with 4 screws. The fan can be removed with the bracket in place, a clever design.

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The fan uses 2-ball bearing, which is welcome by some folks "thinking" of longer life but ball-bearing fan will have higher noise than sleeve bearing, believe it or not.

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Top and side comparison to XP-90. Notice the three heat pipes protruding out, I couldn't figure out what the bare pipes are there for. We will find out later.

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The height is very close to Intel Stock Unit.


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